Core Specifications

1. Architecture: Zen 4 (Raphael)

2. Manufacturing Process: TSMC 5nm FinFET

3. Socket: AM5 (LGA 1718)

4. TDP: 65W

5. Max Temperature: 95°C (Tcase), 61°C (Tjunction)

6. Release Date: July 23, 2023 (Q3 2023)

7. Unlocked Multiplier: Yes (supports overclocking via AMD EXPO, PBO) 

Performance

1. Cores / Threads: 6 cores, 12 threads

2. Base Clock: 3.7 GHz

3. Boost Clock: Up to 5.0 GHz (single-core), 4.4 GHz (all-core)

4. Cache:

   • L1: 64 KB per core (384 KB total)

   • L2: 1 MB per core (6 MB total)

   • L3: 32 MB shared 

Memory & Expansion

1. Memory Support: DDR5-5200 (dual-channel)

2. Max RAM Capacity: 128 GB

3. ECC Support: Yes

4. PCIe Version: PCIe 5.0

5. PCIe Lanes: 24 (CPU) + 4 (chipset) = 28 total 

Integrated Features

1. Integrated GPU: None — discrete GPU required

2. Technologies:

   • AMD EXPO™ (memory overclocking)

   • Precision Boost 2

   • SMT (Simultaneous Multithreading)

   • AMD-V (virtualization)

   • Security: EVP, SMAP, SMEP, AES